The FutureLED TRANSFORMER LED wall offers maximum mobility and impresses with its minimal size when folded. Perfect for conference centers, hotels, universities and events – this innovative LED wall automatically extends from a robust flight case on wheels at the touch of a button and unfolds in seconds.
With aspect ratios from 16:9 to 4K UHD and customizable sizes, the FutureLED TRANSFORMER guarantees crystal-clear presentations and perfect visibility in any environment. Thanks to its mobile design, it fits easily through standard doors and into elevators, while the height-adjustable function ensures optimal alignment.
Plug & play: The LED wall is ready for immediate use – just switch it on, connect it and present. Energy-efficient, robust COB technology ensures the highest image quality with minimal power consumption. Optionally, SMD and MIP technologies are also available, as is additional protection through GOB. Whether for training, conferences or hybrid meetings, this mobile LED solution combines innovation, design and convenience.
Good to know: you can get optional warranty extensions and rental options including vandalism insurance for our LED walls in the FutureLED TRANSFORMER series.
COB stands for chip-on-board. In the case of COB LEDs, several LED chips are mounted on a printed circuit board. This method has the advantage of generating greater luminous flux and thus brighter light than usual. In addition, the transitions of the light can no longer be seen, and it shines equally brightly at every point.
Optional: SMD stands for “surface mounted device”, a component that is mounted on a surface. In relation to our LED walls, these are the LEDs that are soldered directly onto a printed circuit board with the connection surface. The pixels are individually placed – which can be clearly felt when running a finger over them due to the rough surface. One advantage is that they can be easily repaired or replaced. SMD LEDs are among the smallest light sources in LED technology.
Optional: MIP is an advanced packaging technology for micro LED displays. Individual LED pixels are packaged and processed into display modules using the SMT (Surface-Mount Technology, in which components are soldered directly onto the surface of a printed circuit board) process. This process offers even greater precision and better color mixing. It allows for smaller pixel pitches (higher resolution) and is more robust than classic SMD LEDs.
Optional: GOB stands for “Glue On Board”, a resin used to fill the spaces and create a flat surface in which the LED pixels are completely embedded. This protective layer effectively protects the display surface from mechanical damage, making it impact-resistant and dust-resistant.
Our video wall series at a glance >>
